thermal: ti-soc-thermal: add thermal data for DRA752 chips
authorEduardo Valentin <eduardo.valentin@ti.com>
Mon, 3 Jun 2013 20:31:55 +0000 (20:31 +0000)
committerChanho Park <chanho61.park@samsung.com>
Tue, 18 Nov 2014 02:45:10 +0000 (11:45 +0900)
commite43ed5e3e921343472cdc63bb6f42c39cdd03390
tree7a87a9f21d2236cad74f99f9ccce60386c65e561
parentbc143ad74f4c7f220d6913a6e5835660a1e0b318
thermal: ti-soc-thermal: add thermal data for DRA752 chips

This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table

Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.

All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
drivers/thermal/ti-soc-thermal/Kconfig
drivers/thermal/ti-soc-thermal/Makefile
drivers/thermal/ti-soc-thermal/dra752-bandgap.h [new file with mode: 0644]
drivers/thermal/ti-soc-thermal/dra752-thermal-data.c [new file with mode: 0644]
drivers/thermal/ti-soc-thermal/ti-thermal.h