Package version up to 3.1.0 49/315049/2 accepted/tizen/unified/20240726.011018 accepted/tizen/unified/dev/20240729.000806
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 03:38:01 +0000 (12:38 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:31:27 +0000 (15:31 +0900)
commitd4d3176b15840461c73e14b9d392e9d1b0a80a6e
tree84ee96558dc9fc2acb46da717809078054f25982
parente923b0ff8d36451c02ba0d108830cdd83280ef80
Package version up to 3.1.0

Change-Id: I9e3a938ca9732bb855310842311d8013a13b1b32
packaging/hal-backend-tbm-exynos-tgm.spec