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(parent: f5b88f7) | patch
core: Add support for dbus activation for thermal 27/210827/1
authorDongwoo Lee <dwoo08.lee@samsung.com>
Thu, 18 Jul 2019 01:51:12 +0000 (10:51 +0900)
committerDongwoo Lee <dwoo08.lee@samsung.com>
Thu, 25 Jul 2019 06:07:01 +0000 (15:07 +0900)
commitd0b00031fc66a21f9c0adb9288f40203d50fcc13
tree0ef5141651d98230afce35eb34c651a722895917tree | snapshot
parentf5b88f70979048877da0ebfca69eb80f8cd3e3cccommit | diff
core: Add support for dbus activation for thermal

To support dbus activation by not only pass core but also thermal,
this patch adds dbus activation support.

Change-Id: I50e13d43df9c775ae177a455805af41921f00286
Signed-off-by: Dongwoo Lee <dwoo08.lee@samsung.com>
CMakeLists.txt diff | blob | history
packaging/pass.spec diff | blob | history
systemd/org.tizen.system.thermal.service [new file with mode: 0644] blob
Domain: System / Kernel; Licenses: Apache-2.0;