hwmon/coretemp: Support multi-die/package
authorZhang Rui <rui.zhang@intel.com>
Mon, 13 May 2019 17:58:54 +0000 (13:58 -0400)
committerThomas Gleixner <tglx@linutronix.de>
Thu, 23 May 2019 08:08:33 +0000 (10:08 +0200)
commitcfcd82e632882372db960b50782a439a8ba56c09
tree2706e7c3a24275fcd40f2fa4cca4cc4fca097c69
parent9ea7612c46586d9eacfd517e73ff76ef294feca0
hwmon/coretemp: Support multi-die/package

Package temperature sensors are actually implemented in hardware per-die.

Update coretemp to be "die-aware", so it can expose mulitple sensors per
package, instead of just one.  No change to single-die/package systems.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-hwmon@vger.kernel.org
Link: https://lkml.kernel.org/r/ec2868f35113a01ff72d9041e0b97fc6a1c7df84.1557769318.git.len.brown@intel.com
drivers/hwmon/coretemp.c