packaging: Bump up to 1.16.1
authorjeon <jhyuni.kang@samsung.com>
Wed, 6 Jan 2021 06:50:29 +0000 (15:50 +0900)
committerduna.oh <duna.oh@samsung.com>
Fri, 27 Jan 2023 05:46:10 +0000 (14:46 +0900)
commitcb97177f3867a39bcf7aac7031ae821896e621cf
treec7ab1e670367d1c5e6004b2601501ec9f2078dce
parentb12c6be58db5da6eee17a29cc84305f749381739
packaging: Bump up to 1.16.1

Change-Id: Iae16b868b7d372db197e3e4197d7d6f22f37b345
meson.build
packaging/libinput.spec