Bump to expat 2.2.4 42/152342/2 accepted/tizen/base/20171027.152108 submit/tizen_base/20171012.020336
authorDongHun Kwak <dh0128.kwak@samsung.com>
Tue, 26 Sep 2017 01:20:42 +0000 (10:20 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Tue, 26 Sep 2017 10:04:55 +0000 (19:04 +0900)
commitc9830baca5a11a377d68a8b2123806e48c75a5dc
tree9003c765aa51848e40d0ee445a566eaabfee2b15
parent69e4b0e909c967223ce2652d4aaf326714055c0b
Bump to expat 2.2.4

[Model] All
[BinType] AP
[Customer] OPEN

[Issue#] N/A
[Request] N/A
[Occurrence Version] N/A

[Problem] Version upgrade
[Cause & Measure] Version upgrade
[Checking Method] N/A

[Team] Open Source Management and Setting Part
[Developer] dh0128.kwak
[Solution company] Samsung
[Change Type] N/A

Change-Id: Icd83c3642752b80cf990ad07e675e823f5be0cbc
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
Makefile.in
configure.ac
configure.in [deleted file]
packaging/expat.spec