Bump to expat 2.1.1 48/75448/3 accepted/tizen/3.0/base/20161028.102930 accepted/tizen/base/20160624.170251 submit/tizen_3.0_base/20161028.062323 submit/tizen_base/20160622.042204
authorDongHun Kwak <dh0128.kwak@samsung.com>
Mon, 20 Jun 2016 01:31:09 +0000 (10:31 +0900)
committerMyoungJune Park <mj2004.park@samsung.com>
Wed, 22 Jun 2016 04:21:08 +0000 (13:21 +0900)
commitc5ded00cd55cbe179cab047be997fa6d7ca0149f
treea2528fc0769ce91f9da6dcf9a256dcf6b9bd0831
parentd2d8a3f8b23b35cabe9acb57dfde7ec6b6d57bdc
Bump to expat 2.1.1

[Model] ALL
[BinType] AP
[Customer] OPEN

[Issue#] N/A
[Request] N/A
[Occurrence Version] N/A

[Problem] Bump to expat 2.1.1
[Cause & Measure] Bump to expat 2.1.1
[Checking Method] N/A

[Team] Open Source Management and Setting Part
[Developer] dh0128.kwak
[Solution company] Samsung
[Change Type] N/A

Change-Id: I13499e79d23839f2d6482aafe108af30555ea236
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
Makefile.in
configure.ac
lib/expat.h
lib/expat_external.h
packaging/expat.spec