thermal: extend the cooling device API to include power information
authorJavi Merino <javi.merino@arm.com>
Thu, 26 Feb 2015 19:00:28 +0000 (19:00 +0000)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Wed, 14 Dec 2016 04:51:18 +0000 (13:51 +0900)
commitc234f2efbe3c3b37fd69084242ade6e2352fa23b
treeb46cb3554dac158c736faa90643ccb9c493bae08
parent2c9ef2475a969b1ccbd64e94d2b80f208be44098
thermal: extend the cooling device API to include power information

Add three optional callbacks to the cooling device interface to allow
them to express power.  In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
[jy0922.shim: apply mainline patch]
Signed-off-by: Joonyoung Shim <jy0922.shim@samsung.com>
drivers/thermal/thermal_core.c
include/linux/thermal.h