packaging: bump to 2.24.90
authorChanho Park <chanho61.park@samsung.com>
Thu, 16 Oct 2014 08:14:52 +0000 (17:14 +0900)
committerChanho Park <chanho61.park@samsung.com>
Thu, 16 Oct 2014 08:14:52 +0000 (17:14 +0900)
commitbd5b6b364d3ee763bc4ca19507742097533f27e6
treea02ad1050fa5f1abbebe18290809068881b0f86f
parentf094385fe68ed22cbdabdcccd140fe80dc1f71be
packaging: bump to 2.24.90

Change-Id: I89d1ebb22ddd66970afcfd79050ebac9ca4e41bc
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
packaging/binutils.changes
packaging/binutils.spec
packaging/cross-aarch64-binutils.spec
packaging/cross-arm-binutils.spec
packaging/cross-i386-binutils.spec
packaging/cross-x86_64-binutils.spec