packaging: change from env_common to built-in for generating param.bin
authorJaehoon Chung <jh80.chung@samsung.com>
Tue, 8 May 2018 10:09:20 +0000 (19:09 +0900)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Mon, 15 Nov 2021 10:19:26 +0000 (11:19 +0100)
commitb6cf0525f8aad89c15f9ed33d0d2bc14c63b1953
tree9f631ae6737dac3f5dd9292ac325fe961c8524e6
parentc6a122bb600d6f23a98ed1b37c9a5b511ba56375
packaging: change from env_common to built-in for generating param.bin

environemnt codes had moved to env directory from common.
It's changed to get the default environment from build-in.o.

Change-Id: I15f8c0115fab426ed35547e0063d3361385d1712
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
packaging/u-boot-rpi3.spec