packaging: update version from 2021.10 to 2022.10
authorJaehoon Chung <jh80.chung@samsung.com>
Fri, 29 Jul 2022 00:38:50 +0000 (09:38 +0900)
committerJaehoon Chung <jh80.chung@samsung.com>
Mon, 17 Oct 2022 01:03:48 +0000 (10:03 +0900)
commitb337a6b2656e067ad5a07140c6b6ef8ebebb126f
treef698947d25c1439796e0dfcb4823c917185aeb92
parent23ebf6416ba99a2ae27056b00b48f743c02f6fec
packaging: update version from 2021.10 to 2022.10

Update version from 2021.10 to 2022.19.

Change-Id: I2d96f29a32de54a90f66348cf38a558b60447570
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
packaging/u-boot-amlogic.spec
packaging/u-boot-rpi3-32b.spec
packaging/u-boot-rpi3.spec
packaging/u-boot-rpi4-32b.spec
packaging/u-boot-rpi4.spec
packaging/u-boot.spec