Package version up to 1.1.0 23/315023/2 accepted/tizen/unified/20240726.011003 accepted/tizen/unified/dev/20240729.000741
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 02:43:43 +0000 (11:43 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:19:53 +0000 (15:19 +0900)
commitaf238a7c3fbe22b9f4823e7b033c7c83b1d3ed45
treef70f00401e99ac72447210ccb0af438355064be0
parent3c89daa0ca44020e7577f41a108706b935dda2e6
Package version up to 1.1.0

Change-Id: I2506cb686939a47fe0afbb0e887866a04d4d0477
packaging/hal-backend-tbm-meson.spec