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(parent: da3c269) | patch
script: tizen: sd_fusing_rpi3: increase a hal partition size to 256M
authorJaehoon Chung <jh80.chung@samsung.com>
Thu, 12 Aug 2021 02:55:05 +0000 (11:55 +0900)
committerJaehoon Chung <jh80.chung@samsung.com>
Tue, 17 Oct 2023 04:19:30 +0000 (13:19 +0900)
commitaecb14c5d3f54892152956b0ed572b77fa44e3f5
treeaab9d82527f0a1e68c5e2f696a8eb20d657b7ea8tree | snapshot
parentda3c26907a4abdf56188c2539eb3c2a5c7a3ac37commit | diff
script: tizen: sd_fusing_rpi3: increase a hal partition size to 256M

Increase a hal partition size from 64M to 256M.

Change-Id: I650f2a5f7d946a6d5b251d7c5682b78afa8dd78f
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
scripts/tizen/sd_fusing_rpi3.sh diff | blob | history
Domain: System / Kernel;