Bump to expect 5.45.4 13/265513/1 accepted/tizen_7.0_base accepted/tizen_7.0_base_hotfix accepted/tizen_7.0_base_tool accepted/tizen_7.0_base_tool_hotfix sandbox/dh0128.kwak/expect-5.45.4-20211021 tizen_7.0_base tizen_7.0_base_hotfix accepted/tizen/7.0/base/20230714.002904 accepted/tizen/7.0/base/hotfix/20230714.003719 accepted/tizen/7.0/base/tool/20221028.113157 accepted/tizen/7.0/base/tool/hotfix/20221115.084944 accepted/tizen/base/tool/20211217.071110 submit/tizen_7.0_base/20221028.200901 submit/tizen_7.0_base_hotfix/20221115.161501 submit/tizen_base/20211215.224706 tizen_7.0_m2_release
authorDongHun Kwak <dh0128.kwak@samsung.com>
Thu, 21 Oct 2021 07:41:33 +0000 (16:41 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Thu, 21 Oct 2021 07:41:56 +0000 (16:41 +0900)
commitae2ccfecaa276ff1ad82692d5beda6073f63244c
tree33057484c46618eb30f378dd3143c65415ee9e0d
parentd9fead2bd551129a4e8d5097a3cd7de1fee057c6
Bump to expect 5.45.4

Change-Id: Iafc6fc8d34a93171bbcd6c57db6ef875eabac066
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
packaging/add_pie_compile_option.patch [new file with mode: 0644]
packaging/expect-rpmlintrc [new file with mode: 0644]
packaging/expect.manifest [new file with mode: 0644]
packaging/expect.spec [new file with mode: 0644]