packaging: bump version to v0.24.0 77/271277/1
authorAdrian Szyndela <adrian.s@samsung.com>
Thu, 17 Feb 2022 12:08:43 +0000 (13:08 +0100)
committerAdrian Szyndela <adrian.s@samsung.com>
Thu, 17 Feb 2022 15:09:08 +0000 (16:09 +0100)
commita800e09a4d0acda321548f0a43814f7e5689bdfc
treec29ff0a88846453beb9e42920ca641945c0b77b9
parenta3df260f35d53de07640791e74803a8fbc3c6bbc
packaging: bump version to v0.24.0

Change-Id: Ifc55899f22eb3ae9e0b5b76e8eb41d15d19110e7
packaging/bcc-tools.spec