Bump to expat 2.2.4 40/152340/1
authorAnas Nashif <anas.nashif@intel.com>
Sun, 4 Nov 2012 23:54:57 +0000 (15:54 -0800)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Tue, 26 Sep 2017 01:06:13 +0000 (10:06 +0900)
commita2a1294279a1d25ec12688a8ef9cf9c47786da21
treebebd2aa8e6b762f1802bf9e5cac641279717f0b0
parent91321ac4f69e0f63d5215b1c8dba5022a6f3f1a9
Bump to expat 2.2.4

Change-Id: I75e9e25d8a8b90cdca58c4f788e83fb35de19095
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
Makefile.in
configure.ac
configure.in [new file with mode: 0644]
packaging/baselibs.conf [new file with mode: 0644]
packaging/expat.changes [new file with mode: 0644]
packaging/expat.manifest [new file with mode: 0644]
packaging/expat.spec [new file with mode: 0644]