packaging: Clean up build procedure
authorSlava Barinov <v.barinov@samsung.com>
Mon, 18 Jan 2021 16:23:38 +0000 (19:23 +0300)
committerDongkyun Son <dongkyun.s@samsung.com>
Wed, 3 May 2023 10:48:50 +0000 (19:48 +0900)
commita28c369588ff802a63f9484f3f3646334b22ed72
treedd148aa348bcc9b805384520b0deaa05c54c5911
parent1f29170be5d9e3edf21489fff680cf80df42c8bd
packaging: Clean up build procedure

- Redundant functions removed, build simplified
- Build directory renamed to "build"
- Test procedure fixed, including run_tests_on_device mode
- testresults.rpm package enhanced and now contains test output

Change-Id: Ia3754697d6cff7e79b20be09450a20513d066383
packaging/glibc.spec