Build and package kdbus tests 33/269233/2
authorŁukasz Stelmach <l.stelmach@samsung.com>
Tue, 4 Jan 2022 18:27:38 +0000 (19:27 +0100)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 12 Jan 2022 21:14:51 +0000 (22:14 +0100)
commit9ee45ede2fe59351a5abb26b1892053a4bb7e869
tree35897b0e4f945c44a3e08403f8a868cecf932e05
parentcc15cc5604fe6ef42079b1b315919b3428407f3a
Build and package kdbus tests

Change-Id: I797e79acf31e4e2e88f71430d7d570069850e819
Signed-off-by: Łukasz Stelmach <l.stelmach@samsung.com>
packaging/linux-tizen-modules-source.spec
tests/kdbus/Makefile