packaging: Bump up to 0.10.0
authorjeon <jhyuni.kang@samsung.com>
Fri, 21 Feb 2020 05:33:10 +0000 (14:33 +0900)
committerDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 05:50:15 +0000 (14:50 +0900)
commit9adc555dcf6184770e1e9970113d167474b81635
tree01da39bfcbc831d17f826ae171b763bf610e4fa3
parentcc63cf3d13de04e24c2c42dc667b515e687b0432
packaging: Bump up to 0.10.0

Change-Id: Ie73df143cb587d8ad545cd7023bc0518c1546c85
packaging/libxkbcommon.spec