packaging: Bump up to 1.22.0
authorduna.oh <duna.oh@samsung.com>
Fri, 27 Jan 2023 05:37:22 +0000 (14:37 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Mon, 4 Dec 2023 10:31:00 +0000 (19:31 +0900)
commit989de6bb4ab50f564d6c54e16f6d81e75b99c71e
tree2cd4ec5b6f09d4a598bbf15cb3c1f33b914c575f
parent9c21016917bd49f1a41242d8bbe197ccaa5feab2
packaging: Bump up to 1.22.0
meson.build
packaging/libinput.spec