The Initial Haptic (drv2605l) HAL for RPI3 81/140081/11 accepted/tizen/4.0/unified/20170829.020552 accepted/tizen/unified/20170808.171436 submit/tizen/20170808.025339 submit/tizen_4.0/20170828.100004 submit/tizen_4.0/20170828.110004
authorscott park <scott.park@dignsys.com>
Sat, 22 Jul 2017 11:30:21 +0000 (20:30 +0900)
committerpr.jung <pr.jung@samsung.com>
Thu, 3 Aug 2017 06:30:40 +0000 (15:30 +0900)
commit96e3c420374a7f7ed8f9bbe43fe87246ae451ebe
tree05bd8110df9f8fbb13bbac886c7c0679c4a20c30
parentad7324907d8bdc91fa89b3553dbba0932792bfff
The Initial Haptic (drv2605l) HAL for RPI3

Implemented using PIO (Peripheral-io)
- open_device, close_device, vibrate_monotone, stop_device

Change-Id: Ifc26d9f1397bd38f92b2dccb3916ed1316dfd9bc
Signed-off-by: scott park <scott.park@dignsys.com>
CMakeLists.txt
packaging/feedbackd.spec
src/haptic/gpio_haptic.c [new file with mode: 0755]