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packaging: Remove rpi3 board support 83/284283/1 accepted/tizen/unified/20221117.211625 accepted/tizen/unified/20221118.021711
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Tue, 15 Nov 2022 02:51:54 +0000 (11:51 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Tue, 15 Nov 2022 02:51:57 +0000 (11:51 +0900)
commitc7462563ff366408df34819a941ccb2c4f0ef234
tree05f51b82f64f11dc89331805c9e9c2093b921b55tree | snapshot
parent151a05a5ad16ef6ec3ac86af6005cfddbed30a60commit | diff
packaging: Remove rpi3 board support

From Tizen 7.5, rpi3 support and its build are removed. So
remove swap-modules rpi3 support also.

Change-Id: I9e87c269b0dbebde6c5fad45a5bcc539b2041b4a
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
packaging/baselibs.conf diff | blob | history
packaging/swap-modules.spec diff | blob | history
Domain: SDK / Dynamic Analysis;