packaging: Bump up to 1.8.0
authorJengHyun Kang <jhyuni.kang@samsung.com>
Tue, 24 Oct 2017 07:39:33 +0000 (16:39 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Mon, 4 Dec 2023 10:24:41 +0000 (19:24 +0900)
commit93d6f5e5cab0fec032cc77f11f7172fa7f23d226
tree6a96fb157be6ea3477af265fe004cc79f6ea4fd5
parent034e102feb5104e354abacd1acae53ec5ef2940f
packaging: Bump up to 1.8.0

Change-Id: I4530bc57d1cbc9d9441f95e2e68c944ad7210794
packaging/libinput.spec
src/evdev-fallback.c
src/evdev.c
src/udev-seat.c