packing: Bump up to 1.3.1
authorDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:32:57 +0000 (01:32 +0900)
committerduna.oh <duna.oh@samsung.com>
Mon, 20 Feb 2023 14:05:47 +0000 (23:05 +0900)
commit879407c6978c849ba871665358ce267a3c08e989
tree2c64db3872b7036a588106fd5cc5aea3203358df
parent25e1891fa726d75cd318815de01a939cd6fb9c10
packing: Bump up to 1.3.1
packaging/libxkbcommon.spec