packaging: bump to 7.9
authorChanho Park <chanho61.park@samsung.com>
Wed, 25 Feb 2015 09:06:22 +0000 (18:06 +0900)
committerSungguk Na <sungguk.na@samsung.com>
Fri, 27 Dec 2019 04:20:28 +0000 (13:20 +0900)
commit865500bb17682f7981979973dd1ac4445e5929fd
treeb614dfd434f7ef6dfc112268d803701077dab01e
parent664211ccb7c4e19e82e99ef791a3f5b3beb0f8b4
packaging: bump to 7.9

Change-Id: I898ddb4b10da6971180e60ca67af2ae0dc60be44
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
packaging/gdb.spec