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(parent: 8ff55fe) | patch
dt-bindings: iio: temperature: Add support for tmp006
authorAnup Sharma <anupnewsmail@gmail.com>
Sat, 20 May 2023 10:53:07 +0000 (16:23 +0530)
committerJonathan Cameron <Jonathan.Cameron@huawei.com>
Sun, 28 May 2023 19:21:34 +0000 (20:21 +0100)
commit7ad78a4074a3a357e94b0026639375d86d86b37b
tree50ce9636df68c5d98e225b7c234a8bb6b4d53f99tree | snapshot
parent8ff55fe553b327ab8bcd91133d6a4b1b506f629ecommit | diff
dt-bindings: iio: temperature: Add support for tmp006

Add devicetree binding document for TMP006, IR thermopile sensor.

Signed-off-by: Anup Sharma <anupnewsmail@gmail.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/3bbda3b1402a26cdafc95c7685679f2311365cad.1684579603.git.anupnewsmail@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml [new file with mode: 0644] blob
Domain: System / Kernel;