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packaging: remove unused tw2 board support 75/284675/1 accepted/tizen/unified/20221124.015433
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Wed, 23 Nov 2022 04:42:32 +0000 (13:42 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Wed, 23 Nov 2022 04:42:39 +0000 (13:42 +0900)
commit75b8c448a7928f2b969c1d5fb2917308c2ecd80a
treede1d8017bdf008873f2ec47e373a32efea829c9ctree | snapshot
parentf58ab430e367b438730417438d9de3bc5ca767d8commit | diff
packaging: remove unused tw2 board support

The tw2 wearable target is replaced with tw3 and not used.
Remove build for the tw2 board.

Change-Id: Iee53d6bb29cbe5fbe13b435cd56c709bd4780ae8
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
packaging/baselibs.conf diff | blob | history
packaging/swap-modules.spec diff | blob | history
Domain: SDK / Dynamic Analysis;