projects / platform / kernel / linux-rpi3.git / commit
? search:
summary | shortlog | log | commit | commitdiff | tree
(parent: 7d1732e) | patch
packaging: add firmware files to fix packaging error 07/163107/1 accepted/tizen/4.0/unified/20171208.061714 accepted/tizen/unified/20171208.062145 submit/tizen/20171207.090727 submit/tizen/20180109.081546 submit/tizen_4.0/20171207.090657
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Thu, 7 Dec 2017 08:01:21 +0000 (17:01 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Thu, 7 Dec 2017 08:02:22 +0000 (17:02 +0900)
commit70e2f82e2e9d309453e6019c7e4d855a7b50d14d
treef01710f824aa67f8aef5af2776d695676d73333etree | snapshot
parent7d1732e0a7ee5f85f74d17fe24499fe7316db467commit | diff
packaging: add firmware files to fix packaging error

After new firmware files added from the commit 868e1e44c315 ("rpi3:
update firmware files including extra, cutdown and debug features"),
packaging is failed because no package requires the files. Add the
files into package to fix packaging error.

Change-Id: I8752b8a0f18375c90aee918d489bafe66152264e
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
packaging/linux-rpi3-arm64.spec diff | blob | history
Domain: System / Kernel; Licenses: GPL-2.0;