Bump to 1.8.3
authorPhilippe Coval <philippe.coval@open.eurogiciel.org>
Wed, 22 Jan 2014 10:57:53 +0000 (11:57 +0100)
committerJaehwan Kim <jae.hwan.kim@samsung.com>
Thu, 12 Mar 2015 02:23:05 +0000 (11:23 +0900)
commit708d6afbb76a33d988b0d6407bc53ff8e6f51e41
tree276c435ad7bd0b3b268222de6f65466475887fbe
parent15235b8499a6a7638d6bcf58d655a91f3bedad38
Bump to 1.8.3

Change-Id: Icd1b8aea48668df57be1f45161304be32cf48a8f
Signed-off-by: Philippe Coval <philippe.coval@open.eurogiciel.org>
packaging/elementary.spec