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script: tizen: sd_fusing_rpi3: increase a hal partition size to 256M 87/262487/1
authorJaehoon Chung <jh80.chung@samsung.com>
Thu, 12 Aug 2021 02:55:05 +0000 (11:55 +0900)
committerJaehoon Chung <jh80.chung@samsung.com>
Thu, 12 Aug 2021 02:55:05 +0000 (11:55 +0900)
commit6ee56de54a88ce2bb54d139ad6d239b51967ed47
tree5fafa2a1a2a070eea279bbe0cd256b5e7bd6e868tree | snapshot
parent8ea78d580e326a29a3d9a4625eb7f631fef48bfccommit | diff
script: tizen: sd_fusing_rpi3: increase a hal partition size to 256M

Increase a hal partition size from 64M to 256M.

Change-Id: I650f2a5f7d946a6d5b251d7c5682b78afa8dd78f
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
scripts/tizen/sd_fusing_rpi3.sh diff | blob | history
Domain: System / Kernel;