packaging: Bump to 2.12.0
authorPhilippe Coval <philippe.coval@open.eurogiciel.org>
Wed, 5 Nov 2014 10:30:22 +0000 (11:30 +0100)
committerMarcin Niesluchowski <m.niesluchow@samsung.com>
Wed, 21 Sep 2016 14:15:58 +0000 (16:15 +0200)
commit6e8caed038948e845c722bc9209f4d1baf9539e8
tree009be2a45f1f080019b49388d6ed19226bf73019
parent797d9326579213ddc1ee7c7562659ec73da0ab5b
packaging: Bump to 2.12.0

Bug-Tizen: TC-1801
Change-Id: Iaba9185f77bea846cf4a3ac7b1b034a212b8b4ad
Signed-off-by: Philippe Coval <philippe.coval@open.eurogiciel.org>
packaging/atk.spec