Bump to patch 2.7.6 41/269741/1 sandbox/dh0128.kwak/patch-2.7.6-20220120 accepted/tizen/base/tool/20220127.053826 submit/tizen_base/20220120.064941
authorDongHun Kwak <dh0128.kwak@samsung.com>
Thu, 20 Jan 2022 06:03:48 +0000 (15:03 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Thu, 20 Jan 2022 06:04:22 +0000 (15:04 +0900)
commit6c322a8b68f3ecf16b58b93d95ba99022de1a194
tree4e68051817c7b3414b83d85fc2763dabe4c89ee6
parent06fea5a8264556c46c6aa5afa9916071bf4f58f0
Bump to patch 2.7.6

Change-Id: I8bfc8f686ebe93455172e113bd7b129c67b17adc
packaging/patch.manifest [new file with mode: 0644]
packaging/patch.spec [new file with mode: 0644]