packaging: Bump version to 12.2.0
authorDongkyun Son <dongkyun.s@samsung.com>
Wed, 8 Feb 2023 08:17:40 +0000 (17:17 +0900)
committerSlava Barinov <v.barinov@samsung.com>
Thu, 27 Apr 2023 09:07:04 +0000 (12:07 +0300)
commit6b075ec710fd6918de83a24d1e7206158acd70c1
tree826a515240ca6513a1af77353114c0b15e8679dd
parentc102a8c086be5803c2a6995cec1c26e2f2ad34db
packaging: Bump version to 12.2.0

Change-Id: I1e5119b75e065ffd7a27715627de7347d873716f
Signed-off-by: Dongkyun Son <dongkyun.s@samsung.com>
Signed-off-by: Slava Barinov <v.barinov@samsung.com>
packaging/gcc-aarch64.spec
packaging/gcc-armv7hl.spec
packaging/gcc-armv7l.spec
packaging/gcc.spec