packaging: Bump to v208
authorWilliam Douglas <william.douglas@intel.com>
Mon, 7 Oct 2013 21:23:56 +0000 (14:23 -0700)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Fri, 24 Feb 2017 15:08:14 +0000 (16:08 +0100)
commit68c85cb3583aaff3160d788e7a1f0979fab7cd5d
tree620009175d50e1926304fb869594d66c2bc1bf8a
parentd4ca0f47a044b9cbeddeeca6cadbf8be915a4073
packaging: Bump to v208

- Add System label to systemd
packaging/systemd.changes
packaging/systemd.spec