tizen: update specs after v2021.10 rebase and cleanup
authorMarek Szyprowski <m.szyprowski@samsung.com>
Tue, 16 Nov 2021 13:05:00 +0000 (14:05 +0100)
committerJaehoon Chung <jh80.chung@samsung.com>
Wed, 12 Oct 2022 05:48:56 +0000 (14:48 +0900)
commit6798ca5c2c55b10e907644f0809f60d5e49bb6e7
tree2210b15463894382e3d6514104d0e66e53083938
parentf8b3c540babfee542c3d7abe5c022ce736b7cd6e
tizen: update specs after v2021.10 rebase and cleanup

Local, outdated copy of the dtc in tools/dtc has been removed, so the
specs need to be adjusted for this.

Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
packaging/u-boot-amlogic.spec
packaging/u-boot-rpi3-32b.spec
packaging/u-boot-rpi3.spec
packaging/u-boot-rpi4-32b.spec
packaging/u-boot-rpi4.spec