Release version 0.9.6 40/271140/1 submit/tizen/20220216.004707 submit/tizen/20220216.111554
authorHwankyu Jhun <h.jhun@samsung.com>
Wed, 16 Feb 2022 00:42:17 +0000 (09:42 +0900)
committerHwankyu Jhun <h.jhun@samsung.com>
Wed, 16 Feb 2022 00:42:17 +0000 (09:42 +0900)
commit66fd03eff17ccd385e704f4a86f8b95b8b624b5c
tree8bf494e160428bbfd35d1082a499418d3e827bff
parent3c48611ae25e165fa64258017fca9ba4821835db
Release version 0.9.6

Change-Id: I756d0625522d52268b32c11bf523b81b6b736813
Signed-off-by: Hwankyu Jhun <h.jhun@samsung.com>
packaging/bundle.spec