kdbus: build and package kdbus-tests 35/256235/1 accepted/tizen/unified/20210401.110012 submit/tizen/20210401.011549
authorŁukasz Stelmach <l.stelmach@samsung.com>
Mon, 29 Mar 2021 08:35:37 +0000 (10:35 +0200)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 31 Mar 2021 06:05:10 +0000 (08:05 +0200)
commit6437e2a949a5fe05ee4374100181d326690ae2cc
treec68d3bef015684d9e1c19d461561463f08f007c5
parent070d38fff88be4af13aabec872d59073432da303
kdbus: build and package kdbus-tests

Change-Id: Icfcecc2780e6c5cdddaad0440b731ebb9dc49446
Signed-off-by: Łukasz Stelmach <l.stelmach@samsung.com>
packaging/linux-rpi3.spec