packaging: bump to 7.12.1
authorHyeongsik Min <hyeongsik.min@samsung.com>
Tue, 31 Jan 2017 00:20:02 +0000 (09:20 +0900)
committerSungguk Na <sungguk.na@samsung.com>
Fri, 27 Dec 2019 04:20:28 +0000 (13:20 +0900)
commit62b23cbda13d4471deee4dad0dbe46e58768eef7
tree4f66ec99dcd98c860b7c8958de9b2f4f91085a32
parent651d53182cd143822e3997a82d9c034c39f12cd3
packaging: bump to 7.12.1

Change-Id: I21bc1dcfd25cee82cd0768d62f10177670a0762d
Signed-off-by: Hyeongsik Min <hyeongsik.min@samsung.com>
packaging/gdb.spec