Package version up to 3.1.0 46/315046/2 accepted/tizen/unified/20240726.011015 accepted/tizen/unified/dev/20240729.000803
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:27:57 +0000 (15:27 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:28:11 +0000 (15:28 +0900)
commit61f93bc00723aef94ece66f78577c1dcd2da660a
tree3c5a65bd4cc1808031ec53c30a4ac36d33378ceb
parentf120e60adbb5b7af0ee22da6869d3f4c9f3a4834
Package version up to 3.1.0

Change-Id: I5ea96f14bf2d939abf0b4a460a98f3be8457ee2f
packaging/hal-backend-tbm-exynos.spec