arm64: dts: exynos: Add dtsi files for Samsung Exynos5433 64bit SoC

arm64: dts: exynos: Add dtsi files for Samsung Exynos5433 64bit SoC

This patch adds new Exynos5433 dtsi to support 64-bit Exynos5433 SoC
based on Octa-core CPUs (quad Cortex-A57 and quad Cortex-A53).
Exynos5433 supports PSCI (Power State Coordination Interface) v0.1.

This patch includes following Device Tree nodes to support Exynos5433 SoC:
1. Octa cores for big.LITTLE architecture
- Cortex-A53 LITTLE Quad-core
- Cortex-A57 big Quad-core
- Supporting PSCI v0.1

2. Clock controller nodes
- CMU_TOP   : clocks for IMEM/FSYS/G3D/GSCL/HEVC/MSCL/G2D/MFC/PERIC/PERIS
- CMU_CPIF  : clocks for LLI (Low Latency Interface)
- CMU_MIF   : clocks for DRAM Memory Controller
- CMU_PERIC : clocks for UART/I2C/SPI/I2S/PCM/SPDIF/PWM/SLIMBUS
- CMU_PERIS : clocks for PMU/TMU/MCT/WDT/RTC/SECKEY/TZPC
- CMU_FSYS  : clocks for USB/UFS/SDMMC/TSI/PDMA
- CMU_G2D   : clocks for G2D/MDMA
- CMU_DISP  : clocks for DECON/HDMI/DSIM/MIXER
- CMU_AUD   : clocks for Cortex-A5/BUS/AUDIO
- CMU_BUS{0|1|2} : clocks for global data buses and global peripheral buses
- CMU_G3D   : clocks for 3D Graphics Engine
- CMU_GSCL  : clocks for GSCALER
- CMU_APOLLO: clocks for Cortex-A53 Quad-core processor.
- CMU_ATLAS : clocks for Cortex-A57 Quad-core processor,
              CoreSight and L2 cache controller.
- CMU_MSCL  : clocks for M2M (Memory to Memory) scaler and JPEG IPs.
- CMU_MFC   : clocks for MFC (Multi-Format Codec) IP.
- CMU_HEVC  : clocks for HEVC(High Efficiency Video Codec) decoder IP.
- CMU_ISP   : clocks for FIMC-ISP/DRC/SCLC/DIS/3DNR IPs.
- CMU_CAM0  : clocks for MIPI_CSIS{0|1}/FIMC_LITE_{A|B|D}/FIMC_3AA{0|1} IPs.
- CMU_CAM1  : clocks for COrtex-A5/MIPI_CSIS2/FIMC_LITE_C/FIMC-FD IPs.

3. Pinctrl nodes for GPIO
- alive/aud/cpif/ese/finger/fsys/imem/nfc/peric/touch pad

4. Timers
- ARM architecture timer (armv8-timer)
- MCT (Multi Core Timer) timer

5. Interrupt controller (GIC-400)

6. BUS devices
- HS-I2C (High-Speed I2C) device
- SPI (Serial Peripheral Interface) device

7. Sound devices
- I2S bus
- LPASS (Low Power Audio Subsystem)

8. Power management devices
- CPUFREQ for for Cortex-A53/A57
- TMU (Thermal Management Unit) for Cortex-A53/A57, G3D, ISP

9. Display controller devices
- DECON (Display and enhancement controller) for panel output
- DSI (Display Serial Interface)
- MIC (Mobile Image Compressor)

10. USB
- USB 3.0 DRD (Dual Role Device) controller
- USB 3.0 Host controller

11. Storage devices
- MSHC (Mobile Storage Host Controller)

12. Misc devices
- UART devices
- ADC (Analog Digital Converter)
- PWM (Pulse Width Modulation)
- ADMA (Advanced DMA) and PDMA (Peripheral DMA)

Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
Signed-off-by: Joonyoung Shim <jy0922.shim@samsung.com>
Signed-off-by: Inki Dae <inki.dae@samsung.com>
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Beomho Seo <beomho.seo@samsung.com>
Signed-off-by: Jaewon Kim <jaewon02.kim@samsung.com>
Signed-off-by: Hyungwon Hwang <human.hwang@samsung.com>
Signed-off-by: Inha Song <ideal.song@samsung.com>
Signed-off-by: Ingi kim <ingi2.kim@samsung.com>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Andrzej Hajda <a.hajda@samsung.com>
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Tested-by: Andi Shyti <andi.shyti@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>