bump up to release 0.28.16 54/270854/1 accepted/tizen/devbase/tools/20220211.011048 accepted/tizen/devbase/tools/20220211.130539 submit/trunk/20220210.150030 submit/trunk/20220210.152030 submit/trunk/20220210.153030 submit/trunk/20220210.153530 submit/trunk/20220211.173530
authorbiao716.wang <biao716.wang@samsung.com>
Thu, 10 Feb 2022 06:23:31 +0000 (15:23 +0900)
committerbiao716.wang <biao716.wang@samsung.com>
Thu, 10 Feb 2022 06:23:31 +0000 (15:23 +0900)
commit5d990d225b207c801ade0d18e75ad5975640c958
treea88974a1b621f63ae1cf31ccaa4381f44a0f8c82
parent5e47cf2c1a2b7a3334c79f73c457c613f313ac3d
bump up to release 0.28.16

Change-Id: I26023eebe01ca402c8d96503b40bdb10c51dc799
Signed-off-by: biao716.wang <biao716.wang@samsung.com>
ChangeLog
debian/changelog
doc/RELEASE_NOTES
mic/__init__.py
packaging/mic.changes
packaging/mic.spec