WIP: packaging and defconfigs
authorŁukasz Stelmach <l.stelmach@samsung.com>
Tue, 22 Feb 2022 20:03:24 +0000 (21:03 +0100)
committerŁukasz Stelmach <l.stelmach@samsung.com>
Wed, 23 Feb 2022 09:36:07 +0000 (10:36 +0100)
commit58bfcb5c2b3f1f26e3c43d12c66ab64de3ed4c3d
tree4c92f7e7d12471f5e3d073545a7a238b76ec90d8
parentdbf79e56fbf9f3f1e58f5adf53d754e2cc057861
WIP: packaging and defconfigs

Change-Id: I2a789031f29a7c41de02e8ce980e51d0d9918403
Signed-off-by: Łukasz Stelmach <l.stelmach@samsung.com>
arch/arm64/configs/tizen_kvims_rt_defconfig [new file with mode: 0644]
arch/arm64/configs/tizen_odroidg12_rt_defconfig [new file with mode: 0644]
packaging/linux-amlogic.spec