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(parent: 0ef1a7b) | patch
packaging: change from env_common to built-in for generating param.bin
authorJaehoon Chung <jh80.chung@samsung.com>
Tue, 8 May 2018 10:09:20 +0000 (19:09 +0900)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Mon, 15 Nov 2021 11:02:48 +0000 (12:02 +0100)
commit536498af739097fb6390fd5b4012674d4683d62c
tree5fadcbeb7c106cf4735406d9cc70d7329e207245tree | snapshot
parent0ef1a7b1aa96c232e64d046af53e5888d804bdc2commit | diff
packaging: change from env_common to built-in for generating param.bin

environemnt codes had moved to env directory from common.
It's changed to get the default environment from build-in.o.

Change-Id: I15f8c0115fab426ed35547e0063d3361385d1712
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
packaging/u-boot-rpi3.spec diff | blob | history
Domain: System / Kernel;