packaging: bump to 1.5.7
authorSung-Jin Park <sj76.park@samsung.com>
Fri, 20 Oct 2017 04:38:55 +0000 (13:38 +0900)
committerDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:54:59 +0000 (01:54 +0900)
commit5297e43b0a3bea2fd3469a3d6504436f323f99b9
tree371121785fc652c277e23c0c1e2bb90c28825aac
parent82a820cf1d464e3de3b26cd376433e84aee180ca
packaging: bump to 1.5.7

Change-Id: I377188db7c942f3be00a1faef156250c8873b38a
Signed-off-by: Sung-Jin Park <sj76.park@samsung.com>
packaging/libevdev.spec