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(parent: fcb71d7) | patch
packaging: exported kernel-header based on armv7l 38/117538/4 accepted/tizen/unified/20170309.075046 accepted/tizen/wearable/20170307.102922 submit/tizen/20170307.014434 submit/tizen_unified/20170308.100420 submit/tizen_unified/20170309.100419 submit/tizen_wearable/20170307.045503
authorJaechul Lee <jcsing.lee@samsung.com>
Mon, 6 Mar 2017 09:33:36 +0000 (18:33 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Tue, 7 Mar 2017 01:26:14 +0000 (17:26 -0800)
commit4f3041d1220b73400fe7130e09bc8871b7b40a96
tree44bdab80d71ed26a57e1fa1d35b7838ea93f5d1dtree | snapshot
parentfcb71d7b1c186993ccfe1256d07e3c6c94ac8839commit | diff
packaging: exported kernel-header based on armv7l

There were difference in kernel-headers between arch64 and armv7l
architecture. It need to be built and exported respectively. So, I
enabled building and made kernel-headers for armv7l.

Change-Id: Ia890e98a591f3474711313ab41800712717190f8
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
packaging/linux-3.18-exynos7270.spec diff | blob | history
Domain: System / Kernel;