tizen: packaging: support perf build
authorChanho Park <chanho61.park@samsung.com>
Tue, 21 Jan 2014 01:11:34 +0000 (10:11 +0900)
committerChanho Park <chanho61.park@samsung.com>
Tue, 18 Nov 2014 02:46:55 +0000 (11:46 +0900)
commit4a82fad43f454f6da2ffb8871a45cb95c34ede61
treef82c0da836054df7f712997129ba3ff4048d5f90
parent240b93812dc30a88093035d062d02bee926a03db
tizen: packaging: support perf build

Change-Id: Idc375608e3bde344347de6ad37c434b5f16aefbc
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
packaging/linux-kernel.spec