packaging: add rpm packaging spec 47/315547/1
authorYongtaek Jeon <ytjeon@samsung.com>
Fri, 29 Nov 2024 00:40:39 +0000 (09:40 +0900)
committerYongtaek Jeon <ytjeon@samsung.com>
Tue, 3 Dec 2024 04:48:00 +0000 (13:48 +0900)
commit46fb5d35302165f998409dd7a081a807129e1430
tree2692f5cfcc1ca6aaf86ccb783df42b5490e7662b
parentbb8d81b35b7cdccf8fe0c7f90d2e43400a3b34dd
packaging: add rpm packaging spec

For tizen packaging, add rpm packaging spec to build kvim board.

Changes compared to linux-amlogic v4.9.
- Update the Version tag.
- Add python3-devel support for build dependencies.
- Add make option for perf installation to include NO_LIBTRACEEVENT=1.
- Remove traceevent library files during the installation process.
- Change kernel image location(/boot/Image.gz).

Change-Id: I876217310f04b8f2d6fc3a6cc4126ac1c8470805
Signed-off-by: Yongtaek Jeon <ytjeon@samsung.com>
packaging/linux-amlogic.spec [new file with mode: 0644]