packaging: bump version to 0.3.0 76/262476/2 accepted/tizen/unified/20210816.122834 submit/tizen/20210813.142813
authorMateusz Majewski <m.majewski2@samsung.com>
Wed, 11 Aug 2021 11:18:59 +0000 (13:18 +0200)
committerKarol Lewandowski <k.lewandowsk@samsung.com>
Thu, 12 Aug 2021 15:05:08 +0000 (15:05 +0000)
commit3d2317001200be4f02d62533109e1a1a187756cc
tree98b0147824c02692ff0e123e3cd8b6d0e7c9cab1
parent767408dcfd4fa77577f2af075393ebed50f48380
packaging: bump version to 0.3.0

Change-Id: I8d4865e4fc4450aefaf323efe2c2ec92711f698d
packaging/capi-system-peripheral-io.spec