thermal: thermal_core: allow binding with limits on bind_params
authorEduardo Valentin <eduardo.valentin@ti.com>
Tue, 16 Jul 2013 19:26:28 +0000 (15:26 -0400)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Thu, 15 May 2014 05:25:19 +0000 (07:25 +0200)
commit3cd2c804be13991740eae499624b3cb80119b230
tree319c3c105e1599c033ec3aa80d21d5da59250833
parent432e812fd61744b1140cccb9deebe22cb8093103
thermal: thermal_core: allow binding with limits on bind_params

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
drivers/thermal/thermal_core.c