Package version up to 1.1.0 26/315026/2 accepted/tizen/unified/20240731.160101 accepted/tizen/unified/dev/20240729.000744
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 02:46:56 +0000 (11:46 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 24 Jul 2024 06:20:52 +0000 (15:20 +0900)
commit3c1a683eea985dc4593f8cb823593ec0eca359a1
treee9163a6f75679b2ed3af8573b77e64d0273cf3ba
parent09864c3110ca4d28b51fcee572a43fa7a8072ac8
Package version up to 1.1.0

Change-Id: I0f243685e177274959c2703d745498a0b2fc9e5b
packaging/hal-backend-tdm-meson.spec